HTGF participates

CoolSem Technologies secures pre-seed

With WaLTIS® technology, the start-up aims to make HF, photonics and power electronics more efficient and sustainable.
News by Marc Nemitz Marc Nemitz · Eindhoven, 19. January 2026

The Dutch start-up CoolSem Technologies, which specializes in the thermal management of semiconductors, has successfully completed its pre-seed financing round. The lead investor is High-Tech Gründerfonds (HTGF), with KBC Focus Fund NV, Brabant Development Agency (BOM) and TTT Green Tech B.V. (SHIFT Invest) also participating. The European investor syndicate provides CoolSem with a solid financial basis for the next development phase.

Focus on wafer-level thermal management (WaLTIS®)

The funds will be used to further develop wafer-level thermal management technology (WaLTIS®) from the concept stage to engineering samples. The samples will be validated and qualification activities driven forward in collaboration with top customers from the RF, power electronics and photonics sectors. The aim is to demonstrate performance under real operating conditions and pave the way for industrial application.

I am convinced that this technology has the potential to become an indispensable component of future thermal chip design...

Olaf Joeressen, Senior Investment Manager HTGF

Sustainability and efficiency in the semiconductor industry

With increasing pressure on raw materials and rising demands on thermal management, CoolSem addresses critical challenges in the chip industry:

  • Reducing energy losses
  • Extending the life of hardware
  • Reuse of rare materials

In doing so, the company is contributing to a low-carbon circular economy and increasing efficiency in semiconductor production.

CEO comments on pre-seed round

"Heat is increasingly becoming the limiting factor for the performance of semiconductors," explains André van Geelen, CEO of CoolSem Technologies."In RF, photonics and power electronics, conventional materials and packaging approaches are reaching their limits. The pre-seed round enables us to demonstrate our wafer-level technology together with pilot customers and to target the next implementation phase. With HTGF as lead investor and strong partners, we can fully focus on industrial validation."

CoolSem Technologies, based in Eindhoven, the Netherlands, was founded in 2025. The startup develops innovative wafer-level thermal management technologies that reduce thermal resistance and minimize mechanical stress in advanced semiconductor and photonic devices. With its WaLTIS multilayer stack, CoolSem replaces conventional substrates with a specially designed layer structure that optimizes heat flow, stability and reliability.


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