FMC secures 100 million euros for new memory chip standards

The semiconductor manufacturer FMC (Ferroelectric Memory Company) has completed a financing round of around 100 million euros to drive the commercialization of its DRAM+ and 3D-CACHE+ memory chips. With 77 million euros in equity capital, led by HV Capital and the DeepTech & Climate Fund (DTCF), and 23 million euros in public funding, this is one of the largest capital rounds in the European semiconductor sector. Other investors include Vsquared Ventures and existing investors eCAPITAL, Bosch Ventures, Air Liquide Venture Capital, M Ventures (Merck) and Verve Ventures.

Focus on energy efficiency and AI applications

FMC focuses on memory technologies that offer significantly higher energy efficiency and processing speed (more than 100 percent faster and more efficient) compared to established products. The DRAM+ and 3D-CACHE+ chips are particularly designed to support the ramp-up of AI data centers and AI edge applications by optimizing data transfer between memory hierarchies and reducing energy consumption.

Memory chips are the biggest bottleneck in the AI stack. Our technology addresses exactly this problem: faster, more energy-efficient and cheaper than existing solutions.

Thomas Rückes, CEO of FMC

Commercialization and global expansion

FMC plans to use the fresh capital to accelerate the production and global distribution of the memory chips. The technology will be implemented in high-volume 300mm fabs in collaboration with leading DRAM manufacturers and advanced logic foundries, specifically for energy-efficient customer applications. FMC's goal is to establish persistent DRAM and 3D CACHE as the standard in high-performance data centers and replace volatile memory in critical processes."Our memory solutions increase the system efficiency of high-performance databases and AI applications by more than 100 percent and significantly reduce energy consumption," says Rückes.

Strategic importance for Europe

Memory chips are considered a key strategic technology and are currently dominated by South Korea, Taiwan and the USA. Europe only has low production capacities in this segment to date. As a player in Silicon Saxony, FMC wants to strengthen its European position and close a critical gap in semiconductor production.

Investors emphasize the relevance of the technology: Fabian Gruner, Partner at HV Capital, sees the potential to"set a new global industry standard".

FMC sustainably reduces the energy consumption of data centers and at the same time strengthens European sovereignty in the semiconductor sector.

Dr. Torsten Löffler from DTCF

FMC's DRAM+ and 3D-CACHE+ combine high persistence with fast data processing and allow a reduction in time-consuming data transfer between volatile and non-volatile memories. This leads to a significant improvement in system efficiency and opens up new possibilities for energy-efficient AI applications. With the successful completion of the Series C financing, FMC is now well positioned to launch its memory chip technology globally and compete in the over €100 billion market for memory solutions.